With additive manufacturing (3D printing), compactness and reliability of electronic components and printed electronics can be increased. Hensoldt and Nano Dimension recently reported a significant breakthrough in the use of 3D printing in the development of high-performance electronic components.
With a newly developed non-conductive polymer ink and a conductive ink from Nano Dimension, Hensoldt has produced the world's first ten-layer circuit board with high-performance electronics soldered on both sides. Previously, it had not been possible to solder electronic structures to both sides of 3D printed circuit boards.
The AME process (Additively Manufactured Electronics) is very useful when it comes to testing a new design and new functionalities of special electronic components before series production. With this process, prototypes for new electronic circuits can be flexibly and individually manufactured.
Efficient protection for temporary uses: Modular system structure for maximum flexibilitySecuriWall M3 is a mobile, modular surveillance system consisting of sensors, cameras and image recording for temporary surveillance and protection applications. The system is specially designed for short set-up and commissioning times as well as for monitoring tasks with little personnel expenditure.
Unmanned land vehicles - reconnaissance, protection and logisticsThe use of UGVs (Unmanned Ground Vehicles / Unmanned Land Vehicles) is becoming increasingly important in tactical operations. In addition to the rapid development progress in unmanned aerial vehicles (UAV), UGVs also have trend-setting technologies with regard to future military deployment scenarios.